CN
CHINESE ENGLISH
SAMSUNG
EMMC5.0
Product Details
Part Number Version Density Voltage Interface Package Size Temp.
KLM4G1FEAC-B031 eMMC 5.0 4GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -25 ~ 85 °C
KLM8G1GEAC-B031 eMMC 5.0 8GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -25 ~ 85 °C
KLMAG2GEAC-B031 eMMC 5.0 16GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -25 ~ 85 °C
KLMBG4GEAC-B031 eMMC 5.0 32GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -25 ~ 85 °C
KLMCG8GEAC-B031 eMMC 5.0 64GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.2 mm -25 ~ 85 °C
KLM8G1WEMB-B031 eMMC 5.0 8GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C
KLMAG2WEMB-B031 eMMC 5.0 16GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -25 ~ 85 °C
KLMBG4WEBC-B031 eMMC 5.0 32GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -25 ~ 85 °C
KLMCG8WEBC-B031 eMMC 5.0 64GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -25 ~ 85 °C
KLM4G1FEPD-B031 eMMC 5.0 4GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C
KLM8G1GEND-B031 eMMC 5.0 8GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C
KLMAG2GEND-B031 eMMC 5.0 16GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C
KLMBG4GEND-B031 eMMC 5.0 32GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -25 ~ 85 °C
KLMCG8GEND-B031 eMMC 5.0 64GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.0 mm -25 ~ 85 °C
KLM8G1WEPD-B031 eMMC 5.0 8GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C
KLMAG2WEPD-B031 eMMC 5.0 16GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C
KLMBG4WEBD-B031 eMMC 5.0 32GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C
KLMCG8WEBD-B031 eMMC 5.0 64GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.1 mm -25 ~ 85 °C
KLM8G1GESD-B03P eMMC 5.0 8GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C
KLM8G1GESD-B03Q eMMC 5.0 8GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C
KLMAG2GESD-B03P eMMC 5.0 16GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C
KLMAG2GESD-B03Q eMMC 5.0 16GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C
KLMBG4GESD-B03P eMMC 5.0 32GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 85 °C
KLMBG4GESD-B03Q eMMC 5.0 32GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 105 °C
KLMCG8GESD-B03P eMMC 5.0 64GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 85 °C
KLMCG8GESD-B03Q eMMC 5.0 64GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 105 °C
KLM8G1GEME-B041 eMMC 5.1 8GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C
KLMAG1JENB-B041 eMMC 5.1 16GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C
KLMBG2JENB-B041 eMMC 5.1 32GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -25 ~ 85 °C
KLMCG4JENB-B041 eMMC 5.1 64GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -25 ~ 85 °C
KLMCG8GESD-B04P eMMC 5.1 64GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 85 °C
KLMCG8GESD-B04Q eMMC 5.1 64GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 105 °C
KLMDG4UCTA-B041 eMMC 5.1 128GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -25 ~ 85 °C
KLMDG8JEUD-B04P eMMC 5.1 128GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.2 mm -40 ~ 85 °C
KLMDG8JEUD-B04Q eMMC 5.1 128GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.2 mm -40 ~ 105 °C
KLMEG8UCTA-B041 eMMC 5.1 256GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -25 ~ 85 °C
KLM4G1FETE-B041 eMMC 5.1 4GB 1.8 / 3.3 V HS400 11 x 10 x 0.8 mm -25 ~ 85 °C
KLM8G1GESD-B04P eMMC 5.1 8GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C
KLM8G1GESD-B04Q eMMC 5.1 8GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C
KLM8G1GETF-B041 eMMC 5.1 8GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C
KLM8G1GEUF-B04P eMMC 5.1 8GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C
KLM8G1GEUF-B04Q eMMC 5.1 8GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C
KLMAG1JETD-B041 eMMC 5.1 16GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C
KLMAG2GESD-B04P eMMC 5.1 16GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C
KLMAG2GESD-B04Q eMMC 5.1 16GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C
KLMAG2GEUF-B04P eMMC 5.1 16GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C
KLMAG2GEUF-B04Q eMMC 5.1 16GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C
KLMBG2JETD-B041 eMMC 5.1 32GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C
KLMBG4GESD-B04Q eMMC 5.1 32GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 85 °C
KLMBG4GEUF-B04P eMMC 5.1 32GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C
KLMBG4GEUF-B04Q eMMC 5.1 32GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C
KLMCG2KCTA-B041 eMMC 5.1 64GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C
KLMCG2UCTA-B041 eMMC 5.1 64GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C
KLMCG4JETD-B041 eMMC 5.1 64GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -25 ~ 85 °C
KLMCG4JEUD-B04P eMMC 5.1 64GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.2 mm -40 ~ 85 °C
KLMCG4JEUD-B04Q eMMC 5.1 64GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.2 mm -40 ~ 105 °C
KLMCG8GESD-B04P eMMC 5.1 64GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 85 °C
KLMCG8GESD-B04Q eMMC 5.1 64GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 105 °C
KLMDG4UCTA-B041 eMMC 5.1 128GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -25 ~ 85 °C
KLMDG8JEUD-B04P eMMC 5.1 128GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.2 mm -40 ~ 85 °C
KLMDG8JEUD-B04Q eMMC 5.1 128GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.2 mm -40 ~ 105 °C
KLMEG8UCTA-B041 eMMC 5.1 256GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -25 ~ 85 °C
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