| Part Number | Version | Density | Voltage | Interface | Package Size | Temp. |
| KLM4G1FEAC-B031 | eMMC 5.0 | 4GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -25 ~ 85 °C |
| KLM8G1GEAC-B031 | eMMC 5.0 | 8GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -25 ~ 85 °C |
| KLMAG2GEAC-B031 | eMMC 5.0 | 16GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -25 ~ 85 °C |
| KLMBG4GEAC-B031 | eMMC 5.0 | 32GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -25 ~ 85 °C |
| KLMCG8GEAC-B031 | eMMC 5.0 | 64GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.2 mm | -25 ~ 85 °C |
| KLM8G1WEMB-B031 | eMMC 5.0 | 8GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -25 ~ 85 °C |
| KLMAG2WEMB-B031 | eMMC 5.0 | 16GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -25 ~ 85 °C |
| KLMBG4WEBC-B031 | eMMC 5.0 | 32GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -25 ~ 85 °C |
| KLMCG8WEBC-B031 | eMMC 5.0 | 64GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -25 ~ 85 °C |
| KLM4G1FEPD-B031 | eMMC 5.0 | 4GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -25 ~ 85 °C |
| KLM8G1GEND-B031 | eMMC 5.0 | 8GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -25 ~ 85 °C |
| KLMAG2GEND-B031 | eMMC 5.0 | 16GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -25 ~ 85 °C |
| KLMBG4GEND-B031 | eMMC 5.0 | 32GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -25 ~ 85 °C |
| KLMCG8GEND-B031 | eMMC 5.0 | 64GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.0 mm | -25 ~ 85 °C |
| KLM8G1WEPD-B031 | eMMC 5.0 | 8GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -25 ~ 85 °C |
| KLMAG2WEPD-B031 | eMMC 5.0 | 16GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -25 ~ 85 °C |
| KLMBG4WEBD-B031 | eMMC 5.0 | 32GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -25 ~ 85 °C |
| KLMCG8WEBD-B031 | eMMC 5.0 | 64GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.1 mm | -25 ~ 85 °C |
| KLM8G1GESD-B03P | eMMC 5.0 | 8GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -40 ~ 85 °C |
| KLM8G1GESD-B03Q | eMMC 5.0 | 8GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -40 ~ 105 °C |
| KLMAG2GESD-B03P | eMMC 5.0 | 16GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -40 ~ 85 °C |
| KLMAG2GESD-B03Q | eMMC 5.0 | 16GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -40 ~ 105 °C |
| KLMBG4GESD-B03P | eMMC 5.0 | 32GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -40 ~ 85 °C |
| KLMBG4GESD-B03Q | eMMC 5.0 | 32GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -40 ~ 105 °C |
| KLMCG8GESD-B03P | eMMC 5.0 | 64GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -40 ~ 85 °C |
| KLMCG8GESD-B03Q | eMMC 5.0 | 64GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -40 ~ 105 °C |
| KLM8G1GEME-B041 | eMMC 5.1 | 8GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -25 ~ 85 °C |
| KLMAG1JENB-B041 | eMMC 5.1 | 16GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -25 ~ 85 °C |
| KLMBG2JENB-B041 | eMMC 5.1 | 32GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -25 ~ 85 °C |
| KLMCG4JENB-B041 | eMMC 5.1 | 64GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -25 ~ 85 °C |
| KLMCG8GESD-B04P | eMMC 5.1 | 64GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -40 ~ 85 °C |
| KLMCG8GESD-B04Q | eMMC 5.1 | 64GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -40 ~ 105 °C |
| KLMDG4UCTA-B041 | eMMC 5.1 | 128GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -25 ~ 85 °C |
| KLMDG8JEUD-B04P | eMMC 5.1 | 128GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.2 mm | -40 ~ 85 °C |
| KLMDG8JEUD-B04Q | eMMC 5.1 | 128GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.2 mm | -40 ~ 105 °C |
| KLMEG8UCTA-B041 | eMMC 5.1 | 256GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -25 ~ 85 °C |
| KLM4G1FETE-B041 | eMMC 5.1 | 4GB | 1.8 / 3.3 V | HS400 | 11 x 10 x 0.8 mm | -25 ~ 85 °C |
| KLM8G1GESD-B04P | eMMC 5.1 | 8GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -40 ~ 85 °C |
| KLM8G1GESD-B04Q | eMMC 5.1 | 8GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -40 ~ 105 °C |
| KLM8G1GETF-B041 | eMMC 5.1 | 8GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -25 ~ 85 °C |
| KLM8G1GEUF-B04P | eMMC 5.1 | 8GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -40 ~ 85 °C |
| KLM8G1GEUF-B04Q | eMMC 5.1 | 8GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -40 ~ 105 °C |
| KLMAG1JETD-B041 | eMMC 5.1 | 16GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -25 ~ 85 °C |
| KLMAG2GESD-B04P | eMMC 5.1 | 16GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -40 ~ 85 °C |
| KLMAG2GESD-B04Q | eMMC 5.1 | 16GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -40 ~ 105 °C |
| KLMAG2GEUF-B04P | eMMC 5.1 | 16GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -40 ~ 85 °C |
| KLMAG2GEUF-B04Q | eMMC 5.1 | 16GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -40 ~ 105 °C |
| KLMBG2JETD-B041 | eMMC 5.1 | 32GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -25 ~ 85 °C |
| KLMBG4GESD-B04Q | eMMC 5.1 | 32GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -40 ~ 85 °C |
| KLMBG4GEUF-B04P | eMMC 5.1 | 32GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -40 ~ 85 °C |
| KLMBG4GEUF-B04Q | eMMC 5.1 | 32GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -40 ~ 105 °C |
| KLMCG2KCTA-B041 | eMMC 5.1 | 64GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -25 ~ 85 °C |
| KLMCG2UCTA-B041 | eMMC 5.1 | 64GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -25 ~ 85 °C |
| KLMCG4JETD-B041 | eMMC 5.1 | 64GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -25 ~ 85 °C |
| KLMCG4JEUD-B04P | eMMC 5.1 | 64GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.2 mm | -40 ~ 85 °C |
| KLMCG4JEUD-B04Q | eMMC 5.1 | 64GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.2 mm | -40 ~ 105 °C |
| KLMCG8GESD-B04P | eMMC 5.1 | 64GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -40 ~ 85 °C |
| KLMCG8GESD-B04Q | eMMC 5.1 | 64GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -40 ~ 105 °C |
| KLMDG4UCTA-B041 | eMMC 5.1 | 128GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -25 ~ 85 °C |
| KLMDG8JEUD-B04P | eMMC 5.1 | 128GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.2 mm | -40 ~ 85 °C |
| KLMDG8JEUD-B04Q | eMMC 5.1 | 128GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.2 mm | -40 ~ 105 °C |
| KLMEG8UCTA-B041 | eMMC 5.1 | 256GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -25 ~ 85 °C |